+420 54114 9207 | 
nano@ceitec.vutbr.cz
High vacuum coater for deposition of conductive coatings on SEM and TEM samples. Processes are driven by bulit-in microprocessor control unit and are fully automatized. Process steps and parameters are set through a touch screen.
Equipped with Au sputter target and carbon thread evaporation source as standard.
Other targets for sputtering available on request.
| Process vacuum | 5x10−5 mbar @ 15 min |
|---|---|
| Ultimate vacuum | 2x10−6 mbar @ 24 hour |
| Working distance | min. 30 mm, max. 100 mm (z movement motorized) |
| Specimen table | diameter 104 mm |
| Stage tilt | +/- 60° (motorized) |
| Coating time | 1–1800 s (without respect to sample damage) |
| Coating thickness | 1–1000 nm |
| Coating thickness detection | oscillating quartz crystal, readout resolution: one decimal (0.1 nm accuracy) |
| Process gas for sputtering | Argon 99,99 % or better |
| Venting gas | Nitrogen 99,99 % |
| Material | Deposition method | Deposition source |
|---|---|---|
| Carbon (C) | evaporation | carbon thread |
| Gold (Au) | sputtering | target |
| Platinum-Palladium (Pt-Pd: 80/20) | sputtering | target |
| Titanium (Ti) | sputtering | target |
| Nickel (Ni) | sputtering | target |
| Gold-Palladium (Au-Pd: 80/20) | sputtering | target |
| Chromium (Cr) | sputtering | target |
Application Note 1 - Deposition of layers of defined thickness using thickness monitor Application Note 2 - Incorrect layer thickness
